• The Automatic Thermocycling dipping machine is designed for simulation of oral temperature changes. The sample is immersed cyclically in baths of hot, warm and cold fluids. The machine is controlled by programmable logic controller (PLC) system with a touch screen as the interface for users. A simulation cycle was built as a mobile arm with a basket of one or more profiles, where the user can select two or three types of temperature. All six tanks are independent of each other and can be controlled via a touch screen.
  • The UML-V1 is a CNC lathe machine is the first Malaysian Made CNC Lathe. It is designed and developed by researchers and academicians of AMMP Centre, University of Malaya, Malaysia. The machine was designed to incorporate industry standard requirements and features while at the same time is user friendly, especially for beginner-level users.

ANSYS Hands On training Workshop From 23th to 26th June, 2014


ANSYS is the world leading simulation software, it has provided the industries a revolutionizing change in various stages. For example, prototyping requires careful selection of component properties regarding stiffness, strength and vibration characteristics and applies especially to dynamic effects, which require considerable effort for testing. ANSYS simulation provides a clear picture of the behavior of the components being tested during the design stage.


This Workshop is designed to equip you with a powerful set of skill, enable you to perform various types of simulation. In this 4 days workshops, you will be exposed with ANSYS Simulation Software in both theory and physic including the latest techniques, wide area of simulation and intensive training on each subject. At the end of this workshop, participant will find themselves able to produce complex simulations in various aspects of engineering.

Who Should join?

This course is designed for all levels of Academicians, Lecturer, Research scholars/students from academic Institutes and Scientists, Engineers working in Private/ Public/ Government Organizations/ Industries, Research & Development establishments, Technicians and Students who wish to use it in industry or personal use.


Date: 23th to 26th June, 2014

Duration: 4 Days, Mon-Thursday
Time: 9:30 AM - 4:30 PM
Venue: Faculty of Engineering, University of Malaya, Kuala Lumpur
Benefit: Certificate of participation from the University of Malaya, CPD points


Fees: RM 2400

(Early Bird Discount Rm 200 before 6 June, 2014)


Register Now!

Download Registration Form

Fill in the registration form above and send back via
Email: This email address is being protected from spambots. You need JavaScript enabled to view it. ,
Fax: 03 7967 4489
Mail to us at
"Zecttron Sdn. Bhd, Level 5, UM Centre of Innovation and Commercialization (UMCIC) Level 5, Research Management & Innovation Complex,
University of Malaya, 50603 Kuala Lumpur, Malaysia"
Register Online



Payment can be made with cash, check, money/postal order issued in favor of "Zecttron Sdn. Bhd" and send with registration form
via our bank account "CIMB 8600226882"

Tel: 03 7967 4489 and Mobile: 017 3580491 (Khairul Fathi)



23/5 - Monday

- Mechanical Basics
- General Preprocessing
- Meshing in Mechanical

24/5 - Tuesday

Thermal Analysis 
- Static Structural Analysis
- Linear Structural Analysis

25/5 - Wednesday

- Vibration Analysis
- Thermal Analysis 
- Results and Post Processing

26/5 - Thursday

-Parameter Management
- Intensive Tutorials
- Guidelines for Good Analysis 


Speaker’s Profile-
Adam Ng graduated from the University of Malaya with Bachelor of Engineering (CAD/CAM) and Master of Engineering (Manufacturing). He is well versed in almost all major Finite Element Analysis (FEA) software, i.e. ANSYS, FloTHERM, ABAQUS, IDEAS, FEMAP, Cosmos/M, UG NX, etc. Since he has been involved with FEA for over 15 years. As a respected consultant with a wealth of industrial experience, he was appointed as Industrial Adviser for University of Tunku Abdul Rahman, where he has regularly provided practical input into the university’s curriculum. He has conducted many technical training courses related to design and analysis. He has given FEA course to university academic staff and engineers from different industries. He was the Technical Consultant in FEA for research institutes and universities, to develop an advanced 3-D semiconductor package in a multimillion Ringgit IRPA program collaboration of SIRIM-UKM-UM. Actively participated in international conferences, 20 technical papers have been published.